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共找到7个相关供应商
出口总数量:3 | 近一年出口量:0 高频出口商
最近出口记录:
HS编码:38101000 | 交易描述:Pickling preparations for metal surfaces; soldering, brazing or welding powders and pastes consisting of metal and other materials Ice cream welding tin (500g / jar) IND8.9HFG / T5MC / Alloy: SAC305 / Metal Load: 88% / 500gram per jar, HXS: Indium Corp...
数据已更新到:2022-02-17 更多 >
出口总数量:2 | 近一年出口量:0 高频出口商
最近出口记录:
HS编码:38101000 | 交易描述:Pickling preparations for metal surfaces; soldering, brazing or welding powders and pastes consisting of metal and other materials Cream solder tin (500g/jar) Ind8.9HF/ T5MC/ Alloy: SAC305/Metal Load: 88% /500gram per Jar, code 801760, Hxs: INDIUM CORP...
数据已更新到:2023-10-31 更多 >
出口总数量:1 | 近一年出口量:1 高频出口商
最近出口记录:
HS编码:83113091 | 交易描述:Indalloy 281 eutectic alloy solder wire, roll form, content: 58% Bismuth, 42% Tin, no flux, used in laser head repair, diameter 0.03inch, part 5403-0079, manufacturer: Indium Corp of America, HM 100%
数据已更新到:2025-06-10 更多 >
出口总数量:1 | 近一年出口量:0 高频出口商
最近出口记录:
HS编码:3926909709 | 交易描述:INDIUM CORP. OF AMERICA
数据已更新到:2017-12-02 更多 >

INDIUM BATU KAWAN

马来西亚
出口总数量:1 | 近一年出口量:1 高频出口商
最近出口记录:
HS编码:38101000 | 交易描述:SOLDER PASTE SAC305 REC INDIUM 8.9HF TYPE 5-MC 88%, CAS: 7440-31-5, HSX: INDIUM CORP, USED IN INDUSTRY PRODUCTION OF ELECTRONIC COMPONENTS, CIRCUIT BOARDS, SAMPLES, 100% NEW
数据已更新到:2025-07-02 更多 >
出口总数量:1 | 近一年出口量:1 高频出口商
最近出口记录:
HS编码:83113099 | 交易描述:WIREFC-500722 TIN SOLDER WIRE, 0.8MM 0.032 1LB, USED FOR PCB SOLLING, NCC: INDIUM CORP OF AMERICA, SAMPLE, 100% NEW
数据已更新到:2025-07-16 更多 >
出口总数量:1 | 近一年出口量:0 高频出口商
最近出口记录:
HS编码:38101000 | 交易描述:Pickling preparations for metal surfaces; soldering, brazing or welding powders and pastes consisting of metal and other materials Cream solder tin (500g/jar) Ind8.9HF/ T5MC/ Alloy: SAC305/Metal Load: 88% /500gram per Jar, code 801760, Hxs: INDIUM CORP...
数据已更新到:2023-09-07 更多 >
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